Electronic packaging is a critical interdisciplinary field addressing the crucial interface between semiconductor devices and the external environment. It encompasses the comprehensive design, materials science, and manufacturing processes required to interconnect, protect, power, and manage heat for electronic components and systems, from the semiconductor die to the final product. This research area investigates critical aspects such as electrical performance, thermal management, mechanical integrity, materials development, and reliability physics across various scales, and its significance lies in enabling the functionality, performance, miniaturization, and long-term reliability essential for all modern electronic devices.